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[中国联通]:通信行业:中国联通5gredcap终端白皮书(2023版) -尊龙凯时人生就博

信息技术2023-10-31中国联通光***
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中国联通5gredcap终端白皮书(2023版)中国联通5gredcap终端白皮书(2023版)中国联通2023年10月 中国联通5gredcap终端白皮书(2023版)目录前言....................................................................................................................................................11.概述..............................................................................................................................................22.redcap产品分类.........................................................................................................................22.1.redcap模组.....................................................................................................................22.2.redcap终端.....................................................................................................................23.redcap技术要求.........................................................................................................................33.1.redcap基本通信功能要求.............................................................................................33.1.1.制式及选网要求..................................................................................................33.1.2.通信协议要求......................................................................................................33.1.3.频段和带宽要求..................................................................................................33.1.4.基本能力要求......................................................................................................43.1.5.峰值速率要求......................................................................................................43.1.6.接入控制与终端识别要求..................................................................................53.1.7.bwp要求...............................................................................................................53.1.8.移动性要求..........................................................................................................63.1.9.功率等级要求......................................................................................................73.1.10.节能特性要求....................................................................................................73.1.11.5g切片要求.......................................................................................................83.1.12.ip协议栈要求...................................................................................................93.1.13.终端一致性测试要求........................................................................................93.2.redcap增强功能要求.....................................................................................................93.2.1.5glan要求.........................................................................................................93.2.2.sib9高精度授时.................................................................................................93.2.3.urllc功能要求.................................................................................................103.2.4.定位要求............................................................................................................113.2.5.小数据包传输....................................................................................................113.2.6.覆盖增强功能....................................................................................................113.2.7.npn功能要求.....................................................................................................123.2.8.sul要求.............................................................................................................123.2.9.语音能力要求....................................................................................................123.2.10.短信能力要求..................................................................................................124.redcap模组要求.......................................................................................................................124.1.元器件要求....................................................................................................................124.1.1.应用处理器和存储单元....................................................................................134.1.2.usim/esim卡.....................................................................................................134.2.封装要求........................................................................................................................134.3.尺寸要求........................................................................................................................134.4.接口要求........................................................................................................................134.5.功耗性能要求................................................................................................................184.6.平台接入要求................................................................................................................18 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